Device tree binding vendor prefix registry.  Keep list in alphabetical order.

This isn't an exhaustive list, but you should add new prefixes to it before
using them to avoid name-space collisions.

ad	Avionic Design GmbH
adi	Analog Devices, Inc.
ak	Asahi Kasei Corp.
amcc	Applied Micro Circuits Corporation (APM, formally AMCC)
apm	Applied Micro Circuits Corporation (APM)
arm	ARM Ltd.
atmel	Atmel Corporation
bosch	Bosch Sensortec GmbH
brcm	Broadcom Corporation
cavium	Cavium, Inc.
chrp	Common Hardware Reference Platform
cirrus	Cirrus Logic, Inc.
cortina	Cortina Systems, Inc.
dallas	Maxim Integrated Products (formerly Dallas Semiconductor)
denx	Denx Software Engineering
emmicro	EM Microelectronic
epson	Seiko Epson Corp.
est	ESTeem Wireless Modems
fsl	Freescale Semiconductor
GEFanuc	GE Fanuc Intelligent Platforms Embedded Systems, Inc.
gef	GE Fanuc Intelligent Platforms Embedded Systems, Inc.
hp	Hewlett Packard
ibm	International Business Machines (IBM)
idt	Integrated Device Technologies, Inc.
img	Imagination Technologies Ltd.
intercontrol	Inter Control Group
linux	Linux-specific binding
marvell	Marvell Technology Group Ltd.
maxim	Maxim Integrated Products
mosaixtech	Mosaix Technologies, Inc.
national	National Semiconductor
nintendo	Nintendo
nvidia	NVIDIA
nxp	NXP Semiconductors
onnn	ON Semiconductor Corp.
picochip	Picochip Ltd
powervr	PowerVR (deprecated, use img)
qcom	Qualcomm, Inc.
ralink	Mediatek/Ralink Technology Corp.
ramtron	Ramtron International
realtek Realtek Semiconductor Corp.
renesas	Renesas Electronics Corporation
samsung	Samsung Semiconductor
sbs	Smart Battery System
schindler	Schindler
sil	Silicon Image
simtek
sirf	SiRF Technology, Inc.
snps 	Synopsys, Inc.
st	STMicroelectronics
ste	ST-Ericsson
stericsson	ST-Ericsson
ti	Texas Instruments
toshiba	Toshiba Corporation
via	VIA Technologies, Inc.
wlf	Wolfson Microelectronics
wm	Wondermedia Technologies, Inc.
winbond Winbond Electronics corp.
xlnx	Xilinx