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path: root/drivers/usb/musb/da8xx.c
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* usb: musb: drop board_set_vbusFelipe Balbi2010-12-101-2/+0
| | | | | | that's not used anymore. So let's drop it. Signed-off-by: Felipe Balbi <balbi@ti.com>
* usb: musb: move clock handling to glue layerFelipe Balbi2010-12-101-8/+28
| | | | | | | | | musb core doesn't need to know about platform specific details. So start moving clock handling to platform glue layer and make musb core agnostic about that. Signed-off-by: Felipe Balbi <balbi@ti.com>
* usb: musb: pass platform_ops via platform_dataFelipe Balbi2010-12-101-1/+3
| | | | | | | ... then we don't need to export any symbols from glue layer to musb_core. Signed-off-by: Felipe Balbi <balbi@ti.com>
* usb: musb: da8xx: give it a context structureFelipe Balbi2010-12-101-9/+28
| | | | | | | | | | that structure currently only holds a device pointer to our own platform_device and musb's platform_device, but soon it will hold pointers to our clock structures and glue-specific bits and pieces. Signed-off-by: Felipe Balbi <balbi@ti.com>
* usb: musb: split da8xx to its own platform_driverFelipe Balbi2010-12-101-0/+84
| | | | | | | | | | | Just adding its own platform_driver, not really using it yet. When all HW glue layers are converted, more patches will come to split power management code from musb_core and move it completely to HW glue layer. Signed-off-by: Felipe Balbi <balbi@ti.com>
* usb: musb: make all glue layer export struct musb_platform_opsFelipe Balbi2010-12-071-12/+25
| | | | | | | | | | | | | | | | | | preparing to a big refactor on musb code. We need to be able to compile in all glue layers (or at least all ARM-based ones) together and have a working binary. While preparing for that, we move every glue layer to export only one symbol, which is a struct musb_platform_ops, and make all other functions static. Later patches will come to allow for compiling all glue layers together and have a working binary. Signed-off-by: Felipe Balbi <balbi@ti.com>
* usb: musb: introduce DA8xx/OMAP-L1x glue layerSergei Shtylyov2010-10-221-0/+469
Texas Instruments DA8xx/OMAP-L1x glue layer for the MUSBMHRDC driver. Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com> Signed-off-by: Yadviga Grigorieva <yadviga@ru.mvista.com> Signed-off-by: Felipe Balbi <balbi@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>