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| author | Guennadi Liakhovetski <g.liakhovetski@gmx.de> | 2011-03-23 12:42:44 +0100 |
|---|---|---|
| committer | Chris Ball <cjb@laptop.org> | 2011-03-25 10:39:11 -0400 |
| commit | b6147490e6aac82fa2f4b9d7fce925d9891ebe8f (patch) | |
| tree | 71b86fdebebd37bc9e67d5a8902b85f5cb0f1504 /drivers/atm/adummy.c | |
| parent | 5f52c3552946eafa13f89c949449d16ce2b58b24 (diff) | |
| download | kernel_samsung_aries-b6147490e6aac82fa2f4b9d7fce925d9891ebe8f.zip kernel_samsung_aries-b6147490e6aac82fa2f4b9d7fce925d9891ebe8f.tar.gz kernel_samsung_aries-b6147490e6aac82fa2f4b9d7fce925d9891ebe8f.tar.bz2 | |
mmc: tmio: split core functionality, DMA and MFD glue
TMIO MMC chips contain an SD / SDIO IP core from Panasonic, similar to
the one, used in MN5774 and other MN57xx controllers. These IP cores are
included in many multifunction devices, in sh-mobile chips from Renesas,
in the latter case they can also use DMA. Some sh-mobile implementations
also have some other specialities, that MFD-based solutions don't have.
This makes supporting all these features in a monolithic driver inconveniet
and error-prone. This patch splits the driver into 3 parts: the core,
the MFD glue and the DMA support. In case of a modular build, two modules
will be built: mmc_tmio_core and mmc_tmio.
Signed-off-by: Guennadi Liakhovetski <g.liakhovetski@gmx.de>
Acked-by: Paul Mundt <lethal@linux-sh.org>
Signed-off-by: Chris Ball <cjb@laptop.org>
Diffstat (limited to 'drivers/atm/adummy.c')
0 files changed, 0 insertions, 0 deletions