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author | Alan Stern <stern@rowland.harvard.edu> | 2005-09-05 13:55:23 -0400 |
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committer | Greg Kroah-Hartman <gregkh@suse.de> | 2005-09-12 12:23:39 -0700 |
commit | f1a15606d5be8490a122f1c94c554bd0f07d8d26 (patch) | |
tree | 708f2b6be8c5c5ba0db53f7a8c583562f94df6ad /REPORTING-BUGS | |
parent | f7214ff4e8248513ec626212b2c1a3ca0b2a0888 (diff) | |
download | kernel_samsung_crespo-f1a15606d5be8490a122f1c94c554bd0f07d8d26.zip kernel_samsung_crespo-f1a15606d5be8490a122f1c94c554bd0f07d8d26.tar.gz kernel_samsung_crespo-f1a15606d5be8490a122f1c94c554bd0f07d8d26.tar.bz2 |
[PATCH] usbcore: small changes to HCD glue layer
This patch (as549) introduces two small changes in the HCD glue layer.
The first simply removes a redundant test. The second allows root-hub
polling to continue for a single iteration after a host controller dies;
this is needed for the patch that follows.
Signed-off-by: Alan Stern <stern@rowland.harvard.edu>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
Diffstat (limited to 'REPORTING-BUGS')
0 files changed, 0 insertions, 0 deletions