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| author | Tomoya MORINAGA <tomoya-linux@dsn.lapis-semi.com> | 2011-10-28 09:38:49 +0900 |
|---|---|---|
| committer | Greg Kroah-Hartman <gregkh@suse.de> | 2011-11-26 09:09:57 -0800 |
| commit | 6e6d3ebc5179779d72837ff38749843506fd6f7f (patch) | |
| tree | 177d25fd6e461d6bc62a1cbadbc6733c13c3285c /security | |
| parent | b74d0a317e75a602085cf73428bfe7ad456aee85 (diff) | |
| download | kernel_samsung_crespo-6e6d3ebc5179779d72837ff38749843506fd6f7f.zip kernel_samsung_crespo-6e6d3ebc5179779d72837ff38749843506fd6f7f.tar.gz kernel_samsung_crespo-6e6d3ebc5179779d72837ff38749843506fd6f7f.tar.bz2 | |
pch_uart: Support new device LAPIS Semiconductor ML7831 IOH
commit 8249f743f732ccbc3056428945ab1d9bd36d46bf upstream.
ML7831 is companion chip for Intel Atom E6xx series.
Signed-off-by: Tomoya MORINAGA <tomoya-linux@dsn.lapis-semi.com>
Acked-by: Alan Cox <alan@linux.intel.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
Diffstat (limited to 'security')
0 files changed, 0 insertions, 0 deletions