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| author | Matthew Garrett <mjg59@srcf.ucam.org> | 2008-12-03 17:55:32 +0000 |
|---|---|---|
| committer | Len Brown <len.brown@intel.com> | 2009-02-20 18:41:56 -0500 |
| commit | b1569e99c795bf83b4ddf41c4f1c42761ab7f75e (patch) | |
| tree | ad45358dd111e0c4ce71d58565068c47c0171c3d /drivers/thermal/Makefile | |
| parent | 6503e5df08008b9a47022b5e9ebba658c8fa69af (diff) | |
| download | kernel_samsung_smdk4412-b1569e99c795bf83b4ddf41c4f1c42761ab7f75e.zip kernel_samsung_smdk4412-b1569e99c795bf83b4ddf41c4f1c42761ab7f75e.tar.gz kernel_samsung_smdk4412-b1569e99c795bf83b4ddf41c4f1c42761ab7f75e.tar.bz2 | |
ACPI: move thermal trip handling to generic thermal layer
The ACPI code currently carries its own thermal trip handling, meaning that
any other thermal implementation will need to reimplement it. Move the code
to the generic thermal layer.
Signed-off-by: Matthew Garrett <mjg@redhat.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Diffstat (limited to 'drivers/thermal/Makefile')
0 files changed, 0 insertions, 0 deletions